发明名称 MOUNTING STRUCTURE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To inhibit an increase in wiring layers of a first printed board on which a plurality of integrated circuits are mounted adjacently, and to improve freedom of electronic components which can be mounted. SOLUTION: An electronic equipment includes first to fourth integrated circuits 3a-3d, the first printed board 6 on which the integrated circuits 3a-3d are adjacently mounted, a second printed board 7 laminated on and electrically connected with the first printed board 6, and connectors 8 respectively provided on the first and second printed boards 6 and 7 for electrically connecting the boards 6 and 7. The first to fourth integrated circuits 3a-3d have connection terminals 4b on adjacent sides electrically connected with the second printed board 7 via the connectors 8. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007258220(A) 申请公布日期 2007.10.04
申请号 JP20060076810 申请日期 2006.03.20
申请人 NEC CORP 发明人 MATSUI ISAO
分类号 H05K1/14;H01L25/065;H01L25/07;H01L25/18;H05K3/00 主分类号 H05K1/14
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