发明名称 BILL BUNDLING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a bill bundling apparatus which automatically sets temperature and heating time at the optimum condition even when another half-used tape is used or setting of the apparatus is reset while the manufacturing cost of the tape is suppressed. SOLUTION: The bill bundling apparatus has: a tape feeding mechanism 14 for delivering a tape main body 11a; and a bundling part 17 which after the tape main body 11a delivered from the tape feeding mechanism 14 is wound around bills stacked by a specified number of sheets, bundles the bills by pressing a heater 18 and heat-bundling the stacked bills. The bill bundling apparatus is characterized in that an RFID inlet 30 storing the optimum condition data of the heater temperature as the optimum condition data for the heat-bonding of the tape main body 11a is provided on a rolled tape 10a, and that an RFID reader 31 for reading the optimum condition data and a temperature controlling means for controlling the heater temperature of the heater 18 by a signal from the RFID reader 31 are provided. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007253979(A) 申请公布日期 2007.10.04
申请号 JP20060079016 申请日期 2006.03.22
申请人 LAUREL SEIKI KK 发明人 URATA KEN
分类号 B65B27/08;B65B13/18;B65B13/32 主分类号 B65B27/08
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