| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating method capable of easily forming a plating layer high in adhesion to a base metal layer without unevenness. SOLUTION: In the method for forming the plating layer on the base metal layer 18 in a silicon substrate 10 by electroless plating, the silicon substrate 10 subjected to acid cleaning is dipped into a treatment liquid 110 free from a metallic component(s) and one or more components selected from a stabilizer, a complexing agent, a reducing agent or the like from a plating liquid stored in a pretreatment tank 210, is subjected to pretreatment, and is thereafter subjected to electroless plating in an electroless plating tank 220, so as to obtain the plating layer 20. COPYRIGHT: (C)2008,JPO&INPIT
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