Semiconductor wafer breaking device for e.g. integrated circuit chip, has wedge arranged at lower side of wafer premarked in starting area of break line, and arranged opposite to wafer plane such that pressure is exerted at wedge sides

摘要

The device has a breaking wedge (3) arranged at a lower side of a semiconductor wafer (1) that is aligned to a preset break line. A counter support is supported at a top side of the semiconductor wafer. The semiconductor wafer is premarked in a starting area of the preset break line, and the breaking wedge is suitably arranged opposite to the plane of the semiconductor wafer such that pressure is exerted at sides of the breaking wedge in the starting area of the preset break line, where the starting area is preprocessed by the marking.