Fluid cooled electronic assembly

摘要

An electronic assembly (10) is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device (20) within a sealed compartment. The assembly (10) includes a housing generally defining a sealed fluid compartment, an electronic device (20) disposed within the housing (16) and a cooling liquid for cooling the electronic device (20). The assembly (10) includes inlet and outlet ports (44 and 46) in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device (20). Fluid flow channels (26) are formed in thermal communication with the electronic device (20) within the housing (16). The fluid channels (26) include channels that allow liquid to flow in thermal communication with the electronic device (20) to cool the device (20).