| 摘要 |
A high frequency module (1) incorporates a layered substrate (200). The layered substrate has a bottom surface (200a) and a top surface (200b). Terminals (Rx11) are disposed on the bottom surface. SAW filters (121) and inductors (81) are mounted on the top surface. The layered substrate incorporates: a first conductor layer (433) connecting the SAW filters to the inductors; a second conductor layer (451) connected to the terminals and disposed at a location closer to the bottom surface than the first conductor layer; and a plurality of parallel signal paths (701,702) each of which is formed using at least one through hole (h25,h26) provided inside the layered substrate and each of which connects the first and second conductor layers to each other.
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