发明名称 ELECTROPLATING METHOD
摘要 An electroplating method is provided, wherein in case wherein a cycle of electroplating a substrate for plating is repeated by use of a soluble anode in an electroplating bath that can obtain a film of nickel, cobalt, iron or an alloy thereof having high throwing power, the throwing power of the plated film is kept high for a long time without causing external appearance of the plated film to be damaged. As an electroplating method for repeating a cycle of electroplating a substrate for plating by use of a soluble anode in an electroplating bath containing at least one metal ion selected from cobalt, nickel and iron, a buffering agent, and a conductive material, the electroplating method comprises the steps of: setting a concentration of the conductive material in an initially prepared electroplating bath at a level within a saturated concentration range of 70 to 95%; replenishing the buffering agent and the conductive material, each of which is reduced in the amount during the repetition of the electroplating, by adding a first replenishment solution that contains a buffering agent and a conductive material each at a concentration of 0.5 to 1.2 times the concentration contained in the initially prepared electroplating bath and is free of the at least one metal ion to the electroplating bath; and adjusting the concentration of the conductive material in the electroplating bath after the replenishment of the first replenishment solution to 70 to 95% of the saturated concentration, and repeating the electroplating under these conditions.
申请公布号 KR20070096910(A) 申请公布日期 2007.10.02
申请号 KR20070028746 申请日期 2007.03.23
申请人 C. UYEMURA & CO., LTD. 发明人 MURAKAMI TORU
分类号 C25D5/00 主分类号 C25D5/00
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