发明名称 |
High density integral test probe |
摘要 |
A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.
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申请公布号 |
US7276919(B1) |
申请公布日期 |
2007.10.02 |
申请号 |
US19960756830 |
申请日期 |
1996.11.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BEAMAN BRIAN SAMUEL;FOGEL KEITH EDWARD;LAURO PAUL ALFRED;NORCOTT MAURICE H.;SHIH DA-YUAN;WALKER GEORGE FREDERICK |
分类号 |
G01R31/06 |
主分类号 |
G01R31/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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