发明名称 SUBSTRATE SUPPORTING MECHANISM AND SUBSTRATE PROCESSING APPARATUS
摘要 A substrate supporting mechanism and a substrate processing apparatus are provided to surely prevent a discharge from happening between a first region and a second region of a heating element. A platform(5) for supporting a substrate has a heating element(54) made of silicon carbide located in a predetermined pattern. A power feeding electrode(61) feeds an electric power to the power feeding electrode. A partition made of insulator is interposed between adjacent portions of the heating element. The platform has a cover(55) covering an upper surface of the heating element, and the partition is protruded from a rear surface of the cover. The platform has an insulating member(53) provided on a lower portion of the heating element.
申请公布号 KR20070096855(A) 申请公布日期 2007.10.02
申请号 KR20070028074 申请日期 2007.03.22
申请人 TOKYO ELECTRON LIMITED 发明人 YAMASHITA JUN
分类号 H01L21/3065 主分类号 H01L21/3065
代理机构 代理人
主权项
地址