| 摘要 |
<p>A heat spreader module (10) is composed of a joined assembly (12), including a plate member (14), an insulating board (16) disposed on the plate member (14), and a circuit board (18) disposed on the insulating board (16). An IC chip (22) is mounted on an upper surface of the joined assembly (12), or stated otherwise, on an upper surface of the circuit board (18), with a solder layer (20) interposed therebetween. A heat sink (24) is joined by a solder layer (26), for example, onto a lower surface of the joined assembly (12), or stated otherwise, onto a lower surface of the plate member (14), thereby making up a heat sink module (28).</p> |
