发明名称 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
摘要 <p>A plasma processing apparatus and its method is provided to improve the durability of a portion of a chamber or components disposed in the chamber which are exposed to a plasma atmosphere. A plasma processing apparatus includes a chamber(1) accommodating an object to be process with plasma of an etching gas, and a component disposed in the chamber. A portion of the chamber exposed to a plasma forming atmosphere or the component is provided with a composite layer consisting of a porous layer made of a metal oxide and a secondary recrystallized layer of the metal oxide formed on the porous layer. An undercoat layer made from a metal-alloy, ceramic or cermet is formed under the porous layer.</p>
申请公布号 KR20070095210(A) 申请公布日期 2007.09.28
申请号 KR20070026431 申请日期 2007.03.19
申请人 TOKYO ELECTRON LIMITED 发明人 KOBAYASHI YOSHIYUKI
分类号 H01L21/3065 主分类号 H01L21/3065
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