| 摘要 |
A COMPOSITION IS PROVIDED, WHICH IS POLISHING SIO2, SILICATES, AND SILICON NITRIDE, COMPRISING AN AQUESOUS SLURRY OF SUBMICRON SIO2 PARTICLES AND A SOLUBLE INORGANIC SALT OR COMBINATION OF SOLUBLE INORGANIC SALTS OF TOTAL SOLUTION CONCENTRATION BELOW THE CRITICAL COAGULATION CONCENTRATION FOR THE SLURRY, WHEREIN THE SLURRY PH IS ADJUSTED TO WITHIN THE RANGE OF ABOUT 9 TO 10 BY ADDITION OF A SOLUBLE AMINE OR MIXTURE OF SOLUBLE AMINES. OPTIONALLY, THE COMPOSITIONS OF THIS INVENTION MAY ALSO COMPRISE A POLYHYDRIC ALCOHOL.
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