| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which resistive layers whose resistance ratios can be set as designed are provided, in an automatic placement and wiring method of the semiconductor device with the resistive layers. SOLUTION: In the automatic placement and wiring method of a semiconductor integrated circuit, a first dummy metal 8 is arranged near to a resistive layer 3, and then a wiring layer 10 is automatically arranged. Moreover, a second dummy metal 9 larger than the first dummy metal 8 is arranged in an area where the resistive layer 3 and the wiring layer 10 are not arranged. COPYRIGHT: (C)2007,JPO&INPIT |
