| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Pb-free solder layer capable of enhancing optical reflectivity to the luminous wavelength of a light emitting element after the melting and solidification of the solder layer, and provide a substrate for bonding an electronic device using the same, and to provide a method of manufacturing the same. <P>SOLUTION: A solder layer 4 formed on a substrate 2 has surface roughness after the melting and solidification of the solder layer 4 of 0.15 μm or less. A substrate 1 for bonding an electronic device comprises a substrate 2, an electrode layer 3 arranged on the surface of the substrate, and a solder layer 4 arranged on the electrode layer. The surface roughness after the melting and solidification of the solder layer 4 can be 0.15 μm or less. According to this substrate 1 for bonding the electronic device, the solder layer 4 after the melting and solidification becomes a reflecting mirror with high optical reflectivity, and optical extraction efficiency from the light emitting element can be enhanced. <P>COPYRIGHT: (C)2007,JPO&INPIT |
