发明名称 COMPOSITE FOR CHEMICAL MECHANICAL POLISHING
摘要 PROBLEM TO BE SOLVED: To provide a composite for chemical mechanical polishing having a high-level polishing rate and capable of solving a metal dishing and residue problem. SOLUTION: The composite for chemical mechanical polishing contains a compound for polishing, corrosion inhibitor, surfactant, diacid compound, metal residue inhibitor, and water. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007251175(A) 申请公布日期 2007.09.27
申请号 JP20070067443 申请日期 2007.03.15
申请人 CHOKO KAIHATSU KAGI KOFUN YUGENKOSHI 发明人 KO KEIHO;RYU BUNSEI;CHIN HOSHO;CHIN GENRYO;CHIN ZUISEI
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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