DEVICE FOR CONTACT BY ADHESION TO A GLASS OR SEMICONDUCTOR PLATE (WAFER) SURFACE OF THE LIKE, AND SYSTEM FOR GRIPPING SUCH A PLATE COMPRISING SUCH A DEVICE

摘要

1. Device (1) for contact by adhesion to a glass or semiconductor plate (3) (wafer) surface (2) or the like, comprising: a base (10) including a flexible material (4) equipped with an adhesive contact surface (5) intended to be attached to said plate surface (2) by adhesion, means (6) for differentiating the separation resistance between said adhesive contact surface (5) made of the flexible material (4) and the surface (2) of the plate (3), in a direction (7) perpendicular to the adhesive contact surface (5) and in a direction (8) parallel to said adhesive contact surface (5).