IC CHIP PACKAGING MODULE, IC CHIP PACKAGING METHOD, AND IC CHIP

摘要

PROBLEM TO BE SOLVED: To provide an IC chip packaging module and an IC chip for suppressing only unneeded radio waves for operation without losing desired radio waves for operating the IC chip. SOLUTION: A circuit mounted to the IC chip packaged to a cavity in a module body 10 having the cavity is separated into two circuits of first and second regions 11, 12. A third region 13 in which a signal transmission line for connecting both the circuits is present is set to be in a structure for covering the signal transmission line with grounded wiring via an insulator. A radio wave absorber 5 for absorbing radio waves or a metal plate for reflecting radio waves is arranged while the cavity is divided into two adjacent to the upper portion of the third region 13. For the size of the radio wave absorber 5 or the metal plate, the interval to the third region 13 and the interval to the ceiling and sidewall of the cavity are made smaller than 1/4 wavelength in target radio waves, and the width is made narrower than that of the third region 13. Further, a radio wave absorber 7a and/or a radio wave absorber 7b may be arranged at the upper portion of the first region 11 and/or the second region 12. COPYRIGHT: (C)2007,JPO&INPIT