发明名称 BONDING DEVICE AND BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bonding apparatus and a bonding method having realized automatic adjustment in coating amount of paste. SOLUTION: An adequate coating amount of paste is acquired by automatically adjusting drawing/coating amount of paste in the case that the paste P that is drawn/coated on a substrate 3 is imaged with a cameral 14, drawing area of the paste is measured on the basis of the pickup image of the paste P, and an area ratio of this measured drawing area to the adequate drawing/coating area when the adequate amount of paste is coated has exceeded the predetermined threshold value. Coating amount of paste is adjusted with a feedback control considering at least any of paste discharging pressure, paste drawing speed, and paste temperature as the control object. Accordingly, the adequate coating amount of paste can be obtained stably and bonding quality in the bonding process can be homogenized in higher level. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007250617(A) 申请公布日期 2007.09.27
申请号 JP20060068799 申请日期 2006.03.14
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SASAKURI SHINJI
分类号 H01L21/52 主分类号 H01L21/52
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