发明名称 |
Feed device for bringing solder into contact with a metal at a soldering site by laser soldering process useful in laser soldering of metals enables constant controlled amount of solder to be applied to soldering site |
摘要 |
<p>Feed device for bringing an auxiliary material (solder 12) into contact with a metal at a soldering site by a laser soldering process includes a device for applying soldering flux to the solder. The feed device includes a nozzle for applying the flux to the solder. An independent claim is included for a method of feeding solder 12 to the soldering site.</p> |
申请公布号 |
DE102006012064(A1) |
申请公布日期 |
2007.09.27 |
申请号 |
DE20061012064 |
申请日期 |
2006.03.16 |
申请人 |
AUDI AG |
发明人 |
STRAUBE, MARCO;BOEHM, DANIEL;SPEICHER, KLAUS;VOGT, PETER;NIEMEYER, MICHAEL;BUNTE, JENS |
分类号 |
B23K1/005 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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