发明名称 Feed device for bringing solder into contact with a metal at a soldering site by laser soldering process useful in laser soldering of metals enables constant controlled amount of solder to be applied to soldering site
摘要 <p>Feed device for bringing an auxiliary material (solder 12) into contact with a metal at a soldering site by a laser soldering process includes a device for applying soldering flux to the solder. The feed device includes a nozzle for applying the flux to the solder. An independent claim is included for a method of feeding solder 12 to the soldering site.</p>
申请公布号 DE102006012064(A1) 申请公布日期 2007.09.27
申请号 DE20061012064 申请日期 2006.03.16
申请人 AUDI AG 发明人 STRAUBE, MARCO;BOEHM, DANIEL;SPEICHER, KLAUS;VOGT, PETER;NIEMEYER, MICHAEL;BUNTE, JENS
分类号 B23K1/005 主分类号 B23K1/005
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