| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method where the dissolution of a plating seed film is suppressed, and also, the improvement of a plating rate can be realized by a simple means upon electroplating. SOLUTION: The plating method comprises: a stage where a plating object is installed in an electroplating device at least provided with an anode and a power source; a stage where a gelled plating liquid is placed on the plating object; and a stage where the gelled plating liquid is made into a solution, and the power source is made on, so as to perform plating. COPYRIGHT: (C)2007,JPO&INPIT
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