发明名称 Halbleitervorrichtung mit auf einer Strahlungsplatte montiertem Pellet
摘要 A semiconductor device having a pellet mounted on a radiating plate thereof is disclosed. The radiating plate is formed in such a shape that a central portion thereof is positioned higher than both end portions thereof. A pellet is mounted on a lower face of the central portion of the radiating plate, and an upper face of the central portion of the radiating plate is exposed to the top of a resin member. Since the upper face of the central portion of the radiating plate which has the pellet mounted on the lower face thereof is exposed to the resin member, heat generated by the pellet can be radiated efficiently. <IMAGE>
申请公布号 DE69836652(T2) 申请公布日期 2007.09.27
申请号 DE1998636652T 申请日期 1998.05.15
申请人 NEC ELECTRONICS CORP. 发明人 ICHIKAWA, SEIJI;UMEMOTO, TAKESHI;NISHIBE, TOSHIAKI;SATO, KAZUNARI;TSUBOTA, KUNIHIKO;SUGA, MASATO;NISHIMURA, YOSHIKAZU;OKAHIRA, KEITA;MIYA, TATSUYA;KITAKOGA, TORU;TAHARA, KAZUHIRO
分类号 H01L23/29;H01L23/36;H01L21/56;H01L23/495;H01L23/50 主分类号 H01L23/29
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