| 摘要 |
PROBLEM TO BE SOLVED: To provide structure of a testing socket terminal capable of reducing accumulation of tin in a terminal of an integrated circuit, without carrying out wiping cleaning, and is capable of minimizing abrasion and deterioration. SOLUTION: The terminal that is used in a test set and attachable to a load substrate of a testing device has a first end part for forming a large number of contact positions, and connects at least one lead of a tested device electrically to a corresponding metal conductive wire on the load substrate. The next contact position is engaged sequentially with the lead of the tested device, when the terminal is about to rotate about an axis substantially perpendicular to a plane formed by the terminal. COPYRIGHT: (C)2007,JPO&INPIT
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