发明名称 |
Memory module, method of manufacturing a memory module and computer system |
摘要 |
A memory module includes a first pc-board with a plurality of memory chips assembled thereon and with a second pc-board with a second plurality of memory chips assembled thereon. The first pc-board and the second pc-board are connected via first and second connectors placed on the surfaces of the first and second pc-boards.
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申请公布号 |
US2007224854(A1) |
申请公布日期 |
2007.09.27 |
申请号 |
US20060389541 |
申请日期 |
2006.03.27 |
申请人 |
BACHA ABDALLAH;RAGHURAM SIVA |
发明人 |
BACHA ABDALLAH;RAGHURAM SIVA |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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