发明名称 Memory module, method of manufacturing a memory module and computer system
摘要 A memory module includes a first pc-board with a plurality of memory chips assembled thereon and with a second pc-board with a second plurality of memory chips assembled thereon. The first pc-board and the second pc-board are connected via first and second connectors placed on the surfaces of the first and second pc-boards.
申请公布号 US2007224854(A1) 申请公布日期 2007.09.27
申请号 US20060389541 申请日期 2006.03.27
申请人 BACHA ABDALLAH;RAGHURAM SIVA 发明人 BACHA ABDALLAH;RAGHURAM SIVA
分类号 H05K1/00 主分类号 H05K1/00
代理机构 代理人
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