| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for devices capable of satisfactorily processing or treating the surface of a base substrate in the state of joining a support substrate to the base substrate and separating the support substrate comparatively easily. SOLUTION: While forming a penetration part in the base substrate 130, a plurality of minute perforations 131 are formed therein. While applying an adhesive 140 onto the surface of one side of the base substrate, the support substrate 150 is joined to the base substrate with the adhesive. The surface of the base substrate is covered with the support substrate, and the adhesive which has flowed into the outside of the area joined with the base substrate and the support substrate is eliminated by ashing. Then, a predetermined processing or treatment is given to the other side of the base substrate, and then the support substrate is exfoliated from the base substrate by causing a releasing liquid to penetrate the adhesive. COPYRIGHT: (C)2007,JPO&INPIT
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