发明名称 PLASMA CVD APPARATUS, AND FILM DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a plasma CVD apparatus capable of performing the uniform film deposition in a more extensive range than the plasma size. SOLUTION: The plasma CVD apparatus comprises a chamber 10 with a substrate 5 arranged therein, a tubular member 20 having an opening part 18 opened in the chamber 10 so as to be opposite to the substrate 5, a plasma generator 24 for generating plasma into the tubular member 20, and a raw material gas feeder 22 for feeding a raw material gas to the tubular member 20. The inside diameter d of the opening part 18 of the tubular member 20 is smaller than the outside diameter D of the substrate 5. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007247014(A) 申请公布日期 2007.09.27
申请号 JP20060074246 申请日期 2006.03.17
申请人 ULVAC JAPAN LTD 发明人 NAKANO MINAO;YAMAZAKI TAKAHISA;MURAKAMI HIROHIKO
分类号 C23C16/455;C23C16/452;C23C16/511;H01L21/205;H01L21/285 主分类号 C23C16/455
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