| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring structure between electrodes having good wiring circuitry in which wiring connections have been done using a conductive film pattern having little variation in film thickness and no cracks or no high resistance parts. <P>SOLUTION: The wiring structure for an electrode is such that an insulating film 6 partially covers an end of an electrode terminal 4 prepared on a substrate 1 and that of a chip electrode 5 prepared on a semiconductor chip 2, and the substrate 1's surface 1a between the end part of the electrode terminal 4 and that of the chip electrode 5 is covered by the insulating film 6, and the electrode terminal 4 and the chip electrode 5 are wired by conductive film patterns 7 formed on the electrodes 4 and 5 and the insulating film 6. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
