| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for a semiconductor excellent in expansion properties and re-releasability, especially excellent even in the anchoring properties of a pressure-sensitive adhesive layer and a base material film and useful as a holding sheet or the like for a dicing process. SOLUTION: The pressure-sensitive adhesive sheet for the semiconductor is characterized by providing an intermediate layer (B-layer), which contains an acrylic resin containing a nitrogen atom in its molecule, and a radiation curable pressure-sensitive adhesive layer (C-layer), which contains the acrylic resin and a radiation polymerization initiator, at least on one side of the base material film (A-layer) based on a polyvinyl chloride resin in the order of A-layer/B-layer/C-layer. COPYRIGHT: (C)2007,JPO&INPIT |
