| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer wiring board having multilayer wiring structures, which manufacturing method improves yield and reduces manufacturing costs. SOLUTION: A first multilayer wiring structure 16 and a second multilayer wiring structure 56 are formed simultaneously on both surfaces 101A and 101B of a board 101, respectively. Then, a part of a structure 120 that corresponds to a third area C1 is bent so that a second structure 22 and a second structure 62 become opposite to each other, and the first multilayer wiring structure 16 is connected electrically to the second multilayer wiring structure 56. COPYRIGHT: (C)2007,JPO&INPIT |
