| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method therefor which facilitate repairing of a semiconductor chip that is fixed by flip-chip bonding at the uppermost layer. SOLUTION: A second semiconductor chip 3 is mounted on a board 1 via a die-bonding agent 4, and a first semiconductor chip 2 is mounted on the second semiconductor chip 3 via chip electrodes 3a and bumps 5 by flip-chip bonding. Electrodes 3b of the second semiconductor chip 3 are connected to balls 6 formed on electrodes 1a of the board 1 through wires 7. The second semiconductor chip 3 and the wires 7 are sealed integrally in a sealing resin 9, but the first semiconductor chip 2 is completely exposed out of the sealing resin 9. The surface (upper surface) of the chip electrodes 3a of the second semiconductor chip 3 is also exposed out of the sealing resin 9, and the wires 7 are located to be lower than the chip electrodes 3a. COPYRIGHT: (C)2007,JPO&INPIT
|
