| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a downsized angular velocity sensor. <P>SOLUTION: This angular velocity sensor is equipped with a substrate 1 having a recessed part 2, an IC 3 mounted in the recessed part 2 of the substrate 1, an adhesive agent 23 for ICs to bond/fix the IC 3 to the substrate 1, and first and second vibration elements 4 and 5 mounted on the substrate 1 and electrically connected to the IC 3. The recessed part 2 of the substrate 1 comprises an IC mount part 8 mounted with the IC 3, and an injection part 9 connected to the mount part 8 for allowing a nozzle 22 to come therein for thereinto injecting the adhesive agent 23. <P>COPYRIGHT: (C)2007,JPO&INPIT |
