发明名称 |
SEMICONDUCTOR STRUCTURE COMPRISING SUPERLATTICE STRUCTURE, AND SEMICONDUCTOR DEVICE EQUIPPED THEREWITH |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor structure comprising a superlattice structure composed of a nitride semiconductor having a large band gap which reduces stress applied to an interface and which improves an activating ratio of a carrier, and to provide a semiconductor device provided with the semiconductor structure. <P>SOLUTION: The semiconductor structure comprises a substrate 8, a GaN base layer 9 deposited on the substrate 8, and the superlattice structure 11 in which an In<SB>0.17</SB>Al<SB>0.83</SB>N layer and an Al<SB>0.15</SB>Ga<SB>0.85</SB>N layer are laminated periodically on the GaN base layer 9. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007250991(A) |
申请公布日期 |
2007.09.27 |
申请号 |
JP20060074662 |
申请日期 |
2006.03.17 |
申请人 |
NIPPON TELEGR & TELEPH CORP <NTT> |
发明人 |
HIROKI MASANOBU;YOKOYAMA HARUKI;WATANABE NORIYUKI;KOBAYASHI TAKASHI |
分类号 |
H01L29/812;H01L21/338;H01L29/201;H01L29/778;H01L33/06;H01L33/16;H01L33/28;H01L33/32;H01L33/40 |
主分类号 |
H01L29/812 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|