| 摘要 |
PROBLEM TO BE SOLVED: To provide a land structure of a printed wiring board which is capable of preventing a gap from occurring in the mounting position of an LED when the LED is mounted on the printed wiring board by soldering. SOLUTION: The land 9 of a printed wiring board has a configuration in which a part of a conductor 4 is made to appear from an opening 8 provided to an insulating layer formed on the surface of the conductor 4. The LED is connected to the land 9 through solder. The land 9 is equipped with an electrode mount 10 where the electrode 51 of the LED is mounted, and the electrode mount 10 is configured in such a manner in which it extends along the periphery 52a of the mounting surface 52 of an electrode 51. COPYRIGHT: (C)2007,JPO&INPIT
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