| 摘要 |
PROBLEM TO BE SOLVED: To measure the thickness of a mold by utilizing a molded product ejector. SOLUTION: The mold 21a attached to a fixed platen 12 and the movable mold 21b attached to a movable platen 14 are set to a closed state. The movable part 31 of the molded product ejector 30 is moved to detect the movable platen 14 by a sensor 34 and the position Ps of the movable part 31 at this time is calculated. The thickness MH of the mold is calculated from the offset value P0 of the origin position of the coordinates system of the molded product ejector 30 and the origin position of the coordinates system of an injection molding machine and the calculated position Ps as MH=Ps-Po. Since the thickness of the mold can be measured by utilizing the mold ejector, it can be measured inexpensively, simply an accurately. COPYRIGHT: (C)2007,JPO&INPIT
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