发明名称 ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic device without causing an air gap when possible between a terminal for electrical connection insertion formed by a resin and the resin, and to provide its manufacturing method. SOLUTION: The terminal component with a plurality of terminals for electrical connection to the outside insertion formed by the resin comprises a moderate concave bent side provided to the bonding junction surface with an alminum wire bonded at the position exposed from the resin in the range of the approximate same area as that of the exposed part. At this time, an amount of the bending is shown by the equationΔL/L=0.4×10<SP>-2</SP>toΔL/L=1.0×10<SP>-2</SP>, where the L is the length of the exposed surface of the bonding junction rear surface before the resin molding, andΔL is the amount of the bending. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007251075(A) 申请公布日期 2007.09.27
申请号 JP20060075872 申请日期 2006.03.20
申请人 HITACHI LTD 发明人 OHASHI KATSUHIDE;AMAGI SHIGEO;MISHIRO OSAMU;EHATA UICHI
分类号 H01L23/48;H01L23/04;H01L23/08 主分类号 H01L23/48
代理机构 代理人
主权项
地址