| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which electric connection with an inner layer circuit in a core substrate can sufficiently be secured through a through hole, even if the core substrate is divided into multiple layers and which is advantageous for the high density of the through holes. SOLUTION: In the multilayer printed wiring board, a built-up wiring layer where interlayer resin insulating layers and conductor layers are alternately laminated and the conductor layers are connected by a via hole is formed on the multilayer core substrate having the conductor layers on an inner layer. The through hole is formed in the multilayer core substrate. The through hole is filled with a filling material and the conductor layer covering the face of the filling material exposed from the through hole is formed. The conductor layer is composed of a nonelectrolytic plating film and an electrolytic plating film on the nonelectrolytic plating film. The via hole is connected to the conductor layer. COPYRIGHT: (C)2007,JPO&INPIT |
