| 摘要 |
PURPOSE:To prevent solder material from spreading over narrow parts and perform wiring connection to inner leads with certainty by providing the inner leads which extend on each element loading plate through each narrow part after being bent from the narrow part and connecting each thin wiring to a part which is apart from the narrow part of each inner lead. CONSTITUTION:This device is composed of semiconductor elements or circuit elements 21 as well as element loading plates 23 consisting of conductive materials on which the semiconductor elements or the circuit elements 21 are loaded by soldering. Further, inner leads 27 which extend through each narrow part 26 after being bent from the narrow part 26 are provided on each element loading plate 23 and thin wiring 28 is connected to a part which is apart from the narrow part 26 of each inner lead 27. When the semiconductor elements or the circuit elements 21 are loaded on the element loading plates 23, the spread of a solder material is inhibited by the narrow part 23 and does not reach a region to which thin wiring 28 of each inner lead 27 is connected. As a result, a plating face is exposed to the region and then, wire bonding and the like and performed by thermocompression bonding with which ultrasonic waves are used in combination.
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