发明名称
摘要 <p>A high frequency electronic part comprising a conductor wiring for transmitting an electric signal of 100 MHz to 100 GHz, and an insulation layer composed of a void containing thermoplastic resin film orientated in at least one direction by stretching. The void containing thermoplastic resin film contains voids in the range between 3% and 45% by volume, the number of voids in a thickness direction of the film is 5 or more, and a ratio of the number of voids to film thickness defined by the following equation is in the range between 0.1 and 10 voids/μm: ratio of the number of voids to film thickness (voids/μm)=the number of voids (voids) in film thickness direction/film thickness (μm).</p>
申请公布号 JP3981889(B2) 申请公布日期 2007.09.26
申请号 JP20050175454 申请日期 2005.06.15
申请人 发明人
分类号 H01P3/08;C08J9/00;C08K3/00;C08K9/02;C08L67/00;H01B5/14;H01B7/08;H01B11/00 主分类号 H01P3/08
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