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经营范围
发明名称
Mems package
摘要
The MEMS device 56 is mounted in a recess 54 of the multilayered PWB 52 to reduce the thickness of the package for use in mobile telephones, PDAs etc. A cover 76 having an aperture 78 may be provided when a MEMS microphone is mounted on the PWB.
申请公布号
GB0716187(D0)
申请公布日期
2007.09.26
申请号
GB20070016187
申请日期
2007.08.17
申请人
WOLFSON MICROELECTRONICS PLC
发明人
分类号
主分类号
代理机构
代理人
主权项
地址
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