发明名称 Methods for forming a conductive structure using oxygen diffusion through one metal layer to oxidize a second metal layer
摘要 A method for forming a metal/metal oxide structure that includes forming metal oxide regions, e.g. ruthenium oxide regions, at grain boundaries of a metal layer, e.g., platinum. Preferably, the metal oxide regions are formed by diffusion of oxygen through grain boundaries of the metal layer, e.g., platinum, to oxidize a metal layer thereon, e.g, ruthenium layer. The structure is particularly advantageous for use in capacitor structures and memory devices, such as dynamic random access memory (DRAM) devices.
申请公布号 US7273791(B2) 申请公布日期 2007.09.25
申请号 US20030669384 申请日期 2003.09.24
申请人 MICRON TECHNOLOGY, INC. 发明人 BASCERI CEM;SANDHU GURTEJ
分类号 H01G4/005;H01L21/02;H01L21/768 主分类号 H01G4/005
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