| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical component washing tool capable of collectively performing stripping of the optical component from a wafer support surface and a washing operation without the need of performing an operation of cutting and dividing an optical substrate wafer into optical component pieces by a cutter for every optical component while temporarily bonding the optical substrate wafer on the wafer support surface of a cutting tool, and to provide a washing method of optical component using the optical component washing tool. SOLUTION: The optical component washing tool 1 which is attached freely attachably/detachably to the wafer support surface 111 of a cutting tool 100 and covers a plurality of optical components 121 temporarily bonded on the wafer support surface in a prescribed arrangement is provided with: a tool body 10 having a plurality of opening parts 11 through which the upper surfaces of respective optical components arranged on the wafer support surface are respectively individually exposed; and support pieces 15 which can come into contact with non-available regions of the respective optical components by protruding inwards from inner peripheral edges of the respective opening parts. COPYRIGHT: (C)2007,JPO&INPIT
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