发明名称 CONDUCTIVE LAYER PATTERNING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a conductive layer patterning method capable of preventing residues from being produced. <P>SOLUTION: The present invention comprises: a conductive layer forming process for forming a conductive layer L from a conductive material containing aluminum on a substrate P; a resist film forming process for forming a resist film R from an alkali-resistant material on the conductive layer L formed by the conductive layer forming process; an exposure process for exposing the resist film R formed by the resist film forming process via an exposure mask M; and a developing and etching process for developing the resist film R with an alkaline developer, to which a chelate agent has been added, after the exposure process, and etching the conductive layer L. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007233233(A) 申请公布日期 2007.09.13
申请号 JP20060057503 申请日期 2006.03.03
申请人 PIONEER ELECTRONIC CORP 发明人 MATSUBARA ISAYUKI
分类号 G03F7/32;C23F1/00;C23F1/36;G03F7/11;G03F7/40;H01J9/02;H01J11/02;H01J11/22;H01J11/34;H01L21/306;H01L21/3205;H01L21/3213;H01L21/768;H01L23/52;H01L23/532 主分类号 G03F7/32
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