| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated backing plate for boring a printed circuit board which is capable of being efficiently manufactured upon using for boring the conductive hole of the printed circuit board of a multi-layer wiring substrate or the like through drilling work or the like, and which permits piled storage even when a water-soluble resin with tack property is used while being reduced in the mixing of dust or foreign matters and high in quality. SOLUTION: The backing plate for boring the printed circuit board is constituted of an aluminum alloy member, at least one layer of high polymer resin layer provided at least on one surface of the aluminum alloy member and containing lubricating oil, and a separable substrate for protection which is provided on the upper layer of the high polymer resin layer. COPYRIGHT: (C)2007,JPO&INPIT
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