| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component bonding method capable of raising productivity in thermal compression bonding, and to provide a component laminating method. <P>SOLUTION: In the component bonding, a semiconductor component 13 with a thermosetting adhesive layer 13c arranged on its sole surface is bonded to a substrate 5 having a resin layer on the front surface. The resin surface 5a of the substrate 5 is previously reformed by plasma processing so as to raise wetting property, and then, the semiconductor component 13 is held with a component holding nozzle 12 having a heating means. The adhesive layer 13c is abutted onto the resin layer with the surface reformed therein so as to thermally harden the adhesive layer 13c by heating with the heating means. Then, adherence is raised between the adhesive layer 13c and the resin surface 5a. Consequently, the component holding nozzle 12 is separated from the semiconductor component 13 without waiting for the perfect hardening of the adhesive layer 13c, a time required for the component juncture is shortened, so that the productivity is raised in the thermal compression bonding. <P>COPYRIGHT: (C)2007,JPO&INPIT |
