发明名称 ULTRASONIC BONDED STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an ultrasonic bonded structure capable of preventing a joined portion of two plate members from being broken even when the structure is subjected to the vibration. SOLUTION: In the ultrasonic bonded structure for performing the ultrasonic bonding by overlapping bonding surfaces of two plate members each other, and giving the ultrasonic vibration while applying the pressure thereto, stress absorption portions 70 capable of absorbing the stresses exerted in a bonded part 71 are formed separately on the proximal side of the bonded part of one plate member. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007229788(A) 申请公布日期 2007.09.13
申请号 JP20060056760 申请日期 2006.03.02
申请人 NISSAN MOTOR CO LTD 发明人 HAYAMI MUNEHITO;ENOKIDA TAKESHI;SHIMIZU AKIRA;MATSUYAMA HIDENOBU
分类号 B23K20/10;H01M2/20;H01M10/05 主分类号 B23K20/10
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