发明名称 POLISHING COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing composition capable of reducing surface defects such as scratches or projections in the polishing of a magnetic substrate plate treated with Ni-P plating, especially for finish grinding. <P>SOLUTION: This polishing composition for a Ni-containing substrate plate is provided by containing (A) a copolymer resin capable of coordinating with a metallic ion, a polishing promotor and water. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007231209(A) 申请公布日期 2007.09.13
申请号 JP20060057116 申请日期 2006.03.03
申请人 MITSUI CHEMICALS INC 发明人 OIKE SETSUKO
分类号 C09K3/14;B24B37/00;G11B5/84 主分类号 C09K3/14
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