| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve a high density interconnection in sequentially stacked thin film layers of an insulating film and copper formed outside in a multilayer interconnection board where plated through-holes are formed, and to produce a multilayer interconnection board inexpensively, which has excellent heat dissipating property and high frequency property. <P>SOLUTION: Vias for connecting with an outside interconnection layer are formed in a partially extended area of lands where the plated through-holes in a double-sided printed board are filled; and sequentially stacked thin film layers are formed thereon. Columnar copper bodies are formed on the through-holes, and connected with other semiconductors using a conductor having high heat conductivity. Furthermore, the interconnection area of the substrate is shielded with an insulator and a ground layer. In these production methods, filler-containing solvent-free fluid polymer precursor is heated and molten, and then supplied on the substrate using a precise constant-volume dispenser. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
