Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

摘要

An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R₁ through R₇, independently, represents a hydrogen atom or a C₁-C₁₂ hydrocarbon group, provided that when R₁ through R₇ are C₁-C₁₂ hydrocarbon groups, R₁ and R₂, R₂ and R₃, R₃ and R₄, R₄ and R₅, R₅ and R₆, and R₆ and R₇ can be joined to each other to form a cyclic structure.