| 摘要 |
A chip connection method using a bump is provided to form uniformly a metal coupling part in a portion except an anchor protrusion by forming the anchor protrusion in a protruded portion of the upper surface of the main part having a rough surface in a bump. A main part is formed on the surface of a chip by a plating method. An anchor protrusion is formed on the upper surface of the main part by a plating method. A metal coupling part is formed on the upper surface main part including the anchor protrusion by a plating method. A chip in which a bump including the main part and the metal coupling part is formed comes in contact with and is bonded to the metal coupling part of the bump by applying heat and pressure. The main part and the anchor protrusion can be formed on a seed layer formed on the surface of the chip by an electroplating method such that the seed layer is made of the same material as that of the main part.
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