| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To minimize loss of a polishing time for a wafer by incessantly supplying a properly prepared abrasive. <P>SOLUTION: Provided is an abrasive preparing device of a CMP polishing device which has two tanks 21 for abrasive preparation provided side by side. The abrasive preparing device has an abrasive undiluted solution supply line 23 for supplying an abrasive undiluted solution, an additive supply line 24 for supplying an additive, an abrasive circulation line 38 constituted so that while one tank is in operation, operation of the other tank is controlled, a concentration meter which measures the concentration of the additive, and a duct 43 as an abrasive supply line for supplying abrasives to the CMP polishing device 44 from the respective tanks. Feed amounts of additives and/or feed amounts of abrasive undiluted solutions in the respective tanks are calculated, tank by tank, based upon the measurement result of the concentration meter 22 and proper amounts of additives and/or abrasive undiluted solutions are supplied to the respective tanks 21 to prepare the abrasive. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
