| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting method for a dicing blade capable of extraordinarily reducing a generation percentage of defective cut portions, and improving a production yield only by properly performing initial setting of cut conditions without causing productivity degradation due to an increase in the number of processes. <P>SOLUTION: This is a cutting method using the dicing blade 10 rotated and driven by a dicing device along a dicing line 101 formed for partitioning and forming a plurality of optical parts piece regions 102 with small area on a surface of an optical substrate wafer 100. Dicing is performed under the cutting conditions described below: (a) Concentration ratio of the blade: 50-60, (b) Dicing tape adhesive material: acrylic UV hardened type, Adhesive thickness: 5-8μm, Adhesive strength before UV irradiation: 4-7 N/20 mm, Adhesive strength after UV irradiation: 0.37 N/20 mm, (c) Rotational speed of dicing blade: 27,000-30,000 rpm, Feed rate of dicing blade: 10-14 mm/sec. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
